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Substrate preparation

REPAIR

MAIN DATA

Bicomponent pourable epoxy resin for plugging cracks and and adhesion layer.

MAIN FEATURES
Two-components (A+B)
Fluid, pourable
High performance
No schrinkage
High adhesion on cementitous and metallic supports

STORAGE
12 months in dry place

FIELDS OF USE
- Repairing curing cracks in conventional substrates.
- Non structural bonding iron rods or plates to concrete.
- Adhesion-promoter for cement-based skimming and self-levelling mortar on smooth substrates.

SUBSTRATES
Sanded metal, leveling products, wood, fiber cement, concrete, cement-lime mortar, cement-based screeds, old ceramic or marble floors.

FIELDS OF USE

  • 86/14
  • 60 min
  • Trowel/
    Roller
  • 5-30°C

  • Substrate preparation
  • Substrate preparation

Projects